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Vacuum Brazed Liquid Cold Plate Heat Exchanger Hard Anodizing
Détails sur le produit:
| Lieu d'origine: | Dongguan, Guangdong, Chine |
| Nom de marque: | Uchi |
| Certification: | SMC |
| Numéro de modèle: | Dissipateur de chaleur |
Conditions de paiement et expédition:
| Quantité de commande min: | 100 pièces |
|---|---|
| Prix: | 1300-1500 dollars |
| Délai de livraison: | Non limité |
| Conditions de paiement: | T/T, paypal, Western Union, MoneyGram |
| Capacité d'approvisionnement: | 50000000 pièces par mois |
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Détail Infomation |
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| Dimensions: | Personnalisable (par exemple, 100 mm x 100 mm x 10 mm) | Fluide: | Eau ou liquide de refroidissement approprié |
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| Service de traitement: | Usinage CNC + Soudage par friction malaxage | Palier: | Roulement en alliage |
| Poids du produit: | 0,38 kg | Maximum de la pression: | 5 bar |
| Forme: | carré | Lieu d'origine: | cuivre + alliage d'aluminium |
| Fonctionnalité: | Nouvelle technologie et refroidissement haute puissance | courant d'entrée: | ≤12A |
| Capacités matérielles: | Aluminium, Cuivre | Diamètre de sortie: | 1/4 pouce ou personnalisable |
| Technologie: | la commande numérique par ordinateur a usiné | ||
| Mettre en évidence: | vacuum brazed liquid cold plate,hard anodizing heat exchanger,liquid cooling plate heat exchanger |
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Description de produit
Vacuum Brazed Liquid Cold Plate Vacuum Brazed Cold Plate Heat Exchanger
Brand Name: YY Thermal
Size: Custom size
Process:Vacuum Brazing
Material:AL6063
Shape:Square
Finish:Hard anodizing
Quality control:100% test before shipping
Extra process:CNC Machining
Application:Liquid Cold Plate
Certificate:ISO 9001:2015,ISO 14001:2015
Packing:iber Optic Disc Carton,EPE,wooden pallet.
Vacuum Brazed Liquid Cold Plate
Vacuum brazed liquid cold plate is a high-performance liquid cooling component manufactured via vacuum brazing technology, mainly used for high-efficiency heat dissipation in high-power-density equipment. By circulating coolant through sealed internal channels to directly remove heat from heat sources, it has become a mainstream solution in high-end thermal management thanks to its core advantages: oxidation-free, high tightness, low deformation, and excellent corrosion resistance.
I. Core Manufacturing Principle & Process
Vacuum brazing is a welding process performed in a vacuum environment (10⁻³~10⁻⁵ mbar):
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AssemblyPrecisely stack the base plate with machined flow channels, brazing foil (Al‑Si, Cu‑P, etc.), and cover plate.
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Vacuum HeatingPlace the assembly into a vacuum furnace, evacuate the air, then heat to the melting point of brazing filler metal (approx. 577℃–600℃), which is lower than the melting point of the base metal (aluminum/copper).
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Capillary FillingThe molten brazing filler fills all gaps between the base plate, cover plate, and internal fins via capillary action.
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Metallurgical BondingAtomic diffusion occurs between liquid brazing filler and base metal; upon cooling, it forms high-strength, high-thermal-conductivity, fully sealed integrated joints.
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Cooling & FormingSlow cooling under vacuum minimizes thermal stress and ensures zero workpiece deformation.
II. Core Material Options
- Aluminum Alloy (6061/6063): Most widely used — high thermal conductivity, lightweight, low cost, and easy to machine.
- Copper (C1100/T2): Best thermal performance, ideal for ultra-high heat flux applications such as AI chips and IGBTs.
- Stainless Steel / Titanium Alloy: Used for special harsh environments requiring high corrosion and temperature resistance (aerospace, chemical industry).
III. Key Performance Advantages
- Ultra-Clean & Oxidation-Free: Vacuum environment eliminates oxidation, flux residue, porosity, and corrosion risks.
- Strong Sealing & Pressure Resistance: Monolithic structure with zero leakage; typical pressure rating 1–10 MPa.
- Extremely Low Thermal Resistance & High Efficiency: Near‑zero welding thermal resistance; combined with microchannels/fins, thermal resistance can reach as low as 0.02℃·cm²/W.
- Precise Structure & Minimal Deformation: Uniform overall heating ensures high flatness, suitable for precision electronic components.
- High Design Flexibility: Supports complex channels, multi-path layouts, microchannels (0.5 mm), embedded fins, etc.
- Long Service Life & High Reliability: Corrosion‑free and loosening‑free; industrial service life exceeds 10 years.
IV. Typical Internal Flow Channel Structures
- Single-Layer Grooved Channel: Base plate with machined grooves + cover plate; simple structure for low‑to‑medium power.
- Offset / Louvered Folded Fins: Embedded corrugated or serrated fins greatly increase heat exchange area and fluid turbulence; preferred for AI and high-performance computing.
- Skived Fin: Fins integrally cut from the base plate, eliminating contact thermal resistance for extremely high thermal conductivity.
- Microchannel Structure: 50–150 μm scale channels, heat flux > 350 W/cm², ideal for SiC/GaN power modules.
V. Main Application Fields
- AI & Data Centers: Liquid cooling plates for GPUs (NVIDIA H100/H200, A100, etc.) and server cold plates.
- New Energy Vehicles: Power battery pack cold plates, motor control units (MCU), OBC, and IGBT cooling.
- Energy Storage & Power Electronics: PCS, SVG, photovoltaic inverters, high-voltage inverters.
- Aerospace & Defense: High-reliability cooling for radar, laser equipment, and satellite payloads.
- Medical & Lasers: Precision temperature control for CT, MRI, and high-power lasers.
VI. Vacuum Brazing vs. Other Processes
| Properties | Vacuum Brazing | Friction Stir Welding (FSW) | TIG Welding | Adhesive / Mechanical Seal |
|---|---|---|---|---|
| Seal Performance | Excellent (zero leakage) | Good | Fair (prone to leakage) | Poor (aging issues) |
| Internal Structure | Complex channels / fins | Simple channels | Simple channels | Simple channels |
| Thermal Resistance | Extremely low | Low | High | Extremely high |
| Temp./Pressure Res. | High | Medium | Low | Low |
| Surface Quality | Bright, no oxidation | Average | Weld marks visible | Poor |
| Cost | Medium‑high | Medium | Low | Low |
VII. Summary
Vacuum brazed liquid cold plate represents the gold standard for high-performance thermal management, perfectly balancing thermal conductivity, structural strength, sealing reliability, and design flexibility.
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